Flexible Electronics

MicroContinuum's nanopatterning process can provide cost-effective manufacturing solutions for flexible electronics in flat panel displays, touch screens, sensors, etc.

It can be used to form micron and submicron-size electronic circuit elements on flexible films and rigid substrates. This process replaces conventional solvent-based photoresist coating and associated baking and prepping operations with a single pattern mask formation step.

Unlike graphic arts (printing) processes used to form conductive patterns, materials that can be patterned are not limited to available metallic or nanoparticle inks. Additionally, thermal post-curing is not required. Patterns can be made from virtually any metal or dielectric, from aluminum to ITO to tungsten, and on a wide range of flexible substrate materials (PET, PEN, polycarbonate, Kapton, etc.) and over a wide range of substrate thicknesses (5 µm to 500 µm).

Source gate electrodes
In the images above, micron-scale metal patterns are used to form the source/drain and gate electrodes for thin-film transistor (TFTs) arrays.

TFT Patterns
In the examples above, TFT patterns have been formed from a thick (1.2 µm) magnetic alloy layer of CoZrNb on thin (8 µm) Kapton film. Even intrinsically ‘bumpy’ coatings such as these do not degrade the resolution of the process.