We are excited to announce that Dr. Dennis Slafer, Co-Founder and CTO of MicroContinuum, Inc., will be a featured speaker at TechBlick’s Future of Electronics RESHAPED, the premier conference and exhibition in North America dedicated to Additive, Sustainable, Hybrid, Wearable, and 3D Electronics. The two-day event will take place on June 11–12, 2025, at UMass Boston.
Dr. Slafer will present on June 11, sharing MicroContinuum’s groundbreaking work in Scalable Subtractive Roll-to-Roll (R2R) Processes for Producing Multi-Layer Polymer and Metal Nano/Micro-Patterned Films. His talk will explore how these innovative manufacturing techniques are enabling the high-throughput, precision fabrication of flexible, multi-layered structures—critical to advancing the next generation of electronic devices.
With more than two decades of experience in developing R2R nanoimprint and patterning technologies, Dr. Slafer is a recognized leader in the field. His presentation will highlight how MicroContinuum’s solutions support a wide range of applications, from wearable sensors and flexible displays to sustainable and hybrid electronics.
TechBlick’s Future of Electronics RESHAPED is the only event of its kind in the United States and is expected to bring together over 500 global industry leaders, innovators, and researchers. Attendees will gain access to cutting-edge insights, live demonstrations, and in-depth technical sessions on the future of printed, hybrid, and flexible electronics.
Don’t miss this opportunity to hear directly from one of the industry’s pioneers. Join us at UMass Boston and be part of the conversation shaping the future of electronics.
For more information and to register, visit TechBlick’s official website.